Display panel and method for forming micro component support

ABSTRACT

A display panel and a method for forming a micro component support are provided. The method for forming a micro component support includes the following steps. First, a first sacrificial layer is formed on a carrier substrate, where the first sacrificial layer includes a plurality of first openings, and the first openings expose the carrier substrate. Then, a first support layer is formed on the first sacrificial layer and in the first openings. Next, a second sacrificial layer is formed on the first sacrificial layer and the first support layer, where the second sacrificial layer includes a plurality of second openings, and the second openings expose the first support layer. Then, a second support layer is formed on the second sacrificial layer and in the second openings. Next, at least one micro component is formed on the second support layer. Finally, the first sacrificial layer and the second sacrificial layer are removed.

BACKGROUND Technical Field

The present invention relates to a display panel and a method forforming a micro component support.

Related Art

A problem that occurs during packaging is usually one of the bottlenecksof mass production of micro components such as semiconductor inductionapparatuses, semiconductor laser arrays, micro-electro-mechanicalsystems (MEMS), and light emitting diode display systems.

In a conventional method for transferring a micro component, a microcomponent is transferred from a carrier substrate to a receivingsubstrate by means of wafer bonding. One implementation method of thewafer bonding is direct bonding in which a micro component array isdirectly bonded from a carrier substrate to a receiving substrate, andthen the carrier substrate is removed. Another implementation method ofthe wafer bonding is indirect bonding in which bonding/splitting needsto be performed twice. During indirect bonding, first, a transferapparatus extracts a micro component array from a carrier substrate;then, the transfer apparatus bonds the micro component array to areceiving substrate; and finally, the transfer apparatus is removed.

SUMMARY

A technical aspect of the present invention provides a method forforming a micro component support, to improve process yield and processefficiency.

According to an implementation of the present invention, the method forforming a micro component support includes the following steps. First, afirst sacrificial layer is formed on a carrier substrate, wherein thefirst sacrificial layer includes a plurality of first openings, and thefirst openings expose the carrier substrate. Then, a first support layeris formed on the first sacrificial layer and in the first openings.Next, a second sacrificial layer is formed on the first sacrificiallayer and the first support layer, wherein the second sacrificial layerincludes a plurality of second openings, and the second openings exposethe first support layer. Then, a second support layer is formed on thesecond sacrificial layer and in the second openings. Finally, the firstsacrificial layer and the second sacrificial layer are removed afterforming a micro component on the second support layer.

In one or more implementations of the present invention, the methodfurther includes the following steps. First, a transfer apparatus isdisposed on the micro component. Then, the transfer apparatus is causedto apply a downforce via the micro component to the second supportlayer, and to break the first support layer where the first supportlayer connects to the second support layer.

In one or more implementations of the present invention, the methodfurther includes the following steps. The transfer apparatus drives themicro component, the second support layer, and the break-off part tomove downwardly, so that the break-off part is in contact with thecarrier substrate, and the second support layer is not in contact withthe other part of the first support layer.

According to another implementation of the present invention, a displaypanel is provided, including: a display substrate, a fixing layer, asupport, and a micro component. The fixing layer is disposed on thedisplay substrate. The support includes a platform portion and aplurality of extending portions, where the platform portion is disposedon the fixing layer, and the extending portions extend from the platformportion to the fixing layer. The micro component is disposed on theplatform portion.

In one or more implementations of the present invention, each of theextending portions further includes a vertically extending portion and ahorizontally extending portion. The vertically extending portionincludes a first end and a second end, where the first end is connectedto the platform portion, and the horizontally extending portion isconnected to the second end.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 to FIG. 9 are schematic cross-sectional views of process steps ofa micro component support according to an implementation of the presentinvention;

FIG. 10A is a schematic cross-sectional view and a schematic top view ofa micro component support according to an implementation of the presentinvention;

FIG. 10B and FIG. 10C are schematic top views of a micro componentsupport according to different implementations of the present invention;and

FIG. 11 to FIG. 13 are schematic cross-sectional views of process stepsof transferring a micro component according to an implementation of thepresent invention.

DETAILED DESCRIPTION

The following describes a plurality of implementations of the presentinvention by using drawings. For clarity of illustration, many practicaldetails are described below. However, it should be understood that thesepractical details should not be construed as a limitation to the presentinvention. That is, in some implementations of the present invention,these practical details are not necessary. In addition, for simplicityof the drawings, some conventional structures and components are shownin the drawings in a simplified schematic manner.

FIG. 1 to FIG. 9 are schematic cross-sectional views of process steps ofa micro component support according to an implementation of the presentinvention. First, as shown in FIG. 1, a first sacrificial layer 120 isformed on a carrier substrate 110. The first sacrificial layer 120includes a plurality of first openings 121, and the first openings 121expose the carrier substrate 110. In other words, the first sacrificiallayer 120 does not cover a part of the carrier substrate 110.

For example, the material of the carrier substrate 110 may be glass,silicon, sapphire, or another proper material. The first sacrificiallayer 120 may have a single layer or multiple layers, and the materialof the first sacrificial layer 120 may be an inorganic material (such asmetal), an organic material (such as photoresist), or another propermaterial. The first sacrificial layer 120 may be formed by using adeposition process, a coating process, or another proper process. Thefirst openings 121 may be formed by using a lithography and etchingprocess, a photolithography process, or another proper process.

As shown in FIG. 2, a first support layer 130 is formed on the firstsacrificial layer 120 and in the first openings 121. For example, thethickness T1 of the first support layer 130 is substantially less thanthe width W1 of the first opening 121, and the first support layer 130is conformally formed on the first sacrificial layer 120 and in thefirst openings 121. Further, because the thickness T1 of the firstsupport layer 130 is substantially less than the width W1 of the firstopening 121, the first support layer 130 may be conformally formed inthe first openings 121. In this way, it is convenient to use the partthat is of the first support layer 130 and that is conformally formed inthe first openings 121 as a bracket portion of a support that is formedby using a subsequent process.

In an embodiment, a part of the first support layer 130 is formed on andin contact with the carrier substrate 110, and the other part of thefirst support layer 130 is formed on and in contact with the firstsacrificial layer 120. The first support layer 130 may have a singlelayer or multiple layers, and the material of the first support layer130 may be silicon oxide, silicon nitride, amorphous silicon, or anotherproper material. The first support layer 130 may be formed by using adeposition process or another proper process.

As shown in FIG. 3, the first support layer 130 is patterned, so thatthe first support layer 130 includes a plurality of first supportportions 131. The first support portions 131 are mutually separated (Forexample, there is a gap not shown that separates two adjacent firstsupport portions 131). A part of each first support portion 131 isrespectively disposed in the first openings 121 and on the carriersubstrate 110, and the other part of the first support portion 131 isdisposed on the first sacrificial layer 120.

As shown in FIG. 4, a second sacrificial layer 140 is formed on thefirst sacrificial layer 120 and the first support portions 131 (thefirst support layer 130). The second sacrificial layer 140 includes aplurality of second openings 141. The second openings 141 expose a partof each first support portion 131 (the first support layer 130). Inother words, the second sacrificial layer 140 does not cover the otherpart of each first support portion 131. For example, the material of thesecond sacrificial layer 140 may be an inorganic material (such asmetal), an organic material (such as photoresist), or another propermaterial. The second sacrificial layer 140 may be formed by using adeposition process, a photolithography process, or another properprocess. The material of the second sacrificial layer 140 may besubstantially the same as or different from the material of the firstsacrificial layer 120.

An orthographic projection (or referred to as a vertical projection) ofeach first opening 121 on the carrier substrate 110 and an orthographicprojection of each second opening 141 on the carrier substrate 110 arenot overlapped.

The width W2 of the second opening 141 is substantially less than thewidth W1 of the first opening 121, and the thickness T3 of the secondsacrificial layer 140 is substantially greater than the thickness T2 ofthe first sacrificial layer 120. The width W2 of the second opening 141is substantially less than the width W1 of the first opening 121, sothat it is convenient to achieve process integrity.

As shown in FIG. 5, a second support layer 150 is formed on the secondsacrificial layer 140 and in the second openings 141. For example, thethickness T4 of the second support layer 150 is substantially less thanthe width W2 of the second opening 141, and the second support layer 150is conformally formed on the second sacrificial layer 140 and in thesecond openings 141. Further, because the thickness T4 of the secondsupport layer 150 is substantially less than the width W2 of the secondopening 141, the second support layer 150 may be conformally formed inthe second openings 141. In this way, it is convenient to use the partthat is of the second support layer 150 and that is conformally formedin the second openings 141 as a bracket portion of the support that isformed by using a subsequent process.

In an embodiment, a part of the second support layer 150 is formed onand in contact with the first support portions 131 (the first supportlayer 130), and the other part of the second support layer 150 is formedon and in contact with the second sacrificial layer 140. The secondsupport layer 150 may include a single layer or multiple layers, and thematerial of the second support layer 150 may be silicon oxide, siliconnitride, amorphous silicon, metal, or another proper material. Thesecond support layer 150 may be formed by using a deposition process oranother proper process.

For example, the thickness T4 of the second support layer 150 issubstantially greater than the thickness T1 of the first support layer130. The thickness T4 of the second support layer 150 is substantiallygreater than the thickness T1 of the first support layer 130, so that anupper part of the support that is formed by using a subsequent processhas relatively great rigidity, and a lower part of the support hasrelatively small rigidity.

In this implementation, the width W2 of the second opening 141 is onlymultiple times, for example, two to three times the thickness of thesecond support layer 150. Therefore, the part of the second supportlayer 150 that is in the second openings 141 is in a form of a cylinder.In this embodiment, a vertical side wall is used as an example of a sidewall of each first opening 121 and/or a side wall of each second opening141, but this is not limited thereto.

In another embodiment, the side wall of the first opening 121 and/or theside wall of the second opening 141 may be an inclined side, that is,may have a slope.

As shown in FIG. 6, the second support layer 150 is patterned, so thatthe second support layer 150 includes a plurality of second supportportions 151. The second support portions 151 are mutually separated. Apart of each second support portion 151 is respectively disposed in thesecond openings 141 and on the first support portions 131, and the otherpart of the second support portion 151 is disposed on the secondsacrificial layer 140.

Further, each second support portion 151 is respectively connected to aplurality of different first support portions 131. In thisimplementation, each second support portion 151 is connected to twofirst support portions 131. For example, each second support portion 151is connected to two adjacent first support portions 131. In other words,each second support portion 151 respectively partially overlaps the twofirst support portions 131, and each second support portion 151 alsopartially overlaps a gap (such as a place that is not shown and in whichthe first support portions 131 are mutually separated) between the twofirst support portions 131.

As shown in FIG. 7, at least one micro component 200 is formed on thesecond support portions 151 (the second support layer 150).Specifically, the micro component 200 is a micro light emitting diode oranother proper micro component (such as a photoreceptor, a transistor,or another proper component). In this embodiment, a micro light emittingdiode is used as an example of the at least one micro component 200, butthis is not limited thereto. Two horizontally arranged electrodes 210(refer to FIG. 8) that are respectively connected to an electron holelayer (such as a P-type semiconductor or another proper material) and anelectron layer (such as an N-type semiconductor or another propermaterial) are used as an example of the micro light emitting diode, butthis is not limited thereto. In another embodiment, the micro lightemitting diode includes two vertically arranged electrodes that arerespectively connected to an electron hole layer and an electron layer.The photoreceptor may be a visible light photoreceptor, a UVphotoreceptor, an IR photoreceptor, or another proper photoreceptor. Thetransistor may be a bottom-gate transistor, a top-gate transistor, athree-dimensional pass transistor, or another proper transistor. Themicro component 200 may be transferred from another substrate (such as ageneration substrate) by using a transfer apparatus and fixed on thesecond support portions 151, but this is not limited thereto. In anotherembodiment, the micro component 200 may be further directly formed onthe second support portions 151.

A part of each second support portion 151 disposed on the secondsacrificial layer 140 is in a form of a platform, so that the microcomponent 200 can be well fixed on the second support portions 151.

In some embodiments, when the micro component 200 is transferred fromanother substrate (such as a generation substrate) by using a transferapparatus and fixed on the second support portions 151, before the microcomponent 200 is fixed, a patterned adhesive layer 910 may be formed onthe second support portions 151 (the second support layer 150). Then,the micro component 200 is formed (for example, disposed) on theadhesive layer 910, so that the micro component 200 is fixed on thesecond support portions 151 (the second support layer 150).

As shown in FIG. 8, an insulating film 920 is deposited and patterned,so that the insulating film 920 covers the micro component 200. When theinsulating film 920 is patterned, a contact hole 922 is formed, so thatthe electrodes 210 of the micro component 200 are exposed. Theinsulating film 920 may have a single layer or multiple layers, and thematerial of the insulating film 920 may be silicon oxide, siliconnitride, amorphous silicon, or another proper material.

As shown in FIG. 9, the first sacrificial layer 120 and the secondsacrificial layer 140 are removed, so that the remaining first supportportions 131 and the second support portions 151 form a micro componentsupport 330. The micro component support 330 supports and fixes themicro component 200 onto the carrier substrate 110. The firstsacrificial layer 120 and the second sacrificial layer 140 may beremoved by using a chemical etching process or another proper process.

In this implementation, two first support portions 131 and one secondsupport portion 151 form one micro component support 330, but this isnot limited thereto. In another implementation, more than two firstsupport portions 131 and one second support portion 151 may form onemicro component support 330.

FIG. 10A is a schematic cross-sectional view and a schematic top view ofa micro component support 330 according to an implementation of thepresent invention. As shown in FIG. 10A, a second support portion 151includes two vertically extending portions 157, and the two verticallyextending portions 157 are respectively connected to two first supportportions 131. It can be learned from the schematic top view that the twovertically extending portions 157 are respectively and roughly disposedat two opposite angles or on a diagonal path of the micro component 200.The two second support portions 151 are also respectively andcorrespondingly disposed at two opposite angles or on a diagonal path ofthe micro component 200. It should be noted herein that only a contourof the micro component 200 is shown in the schematic top view, and adetailed structure is not shown.

FIG. 10B and FIG. 10C are schematic top views of a micro componentsupport 330 according to different implementations of the presentinvention. As shown in FIG. 10B and FIG. 10C, the micro componentsupport 330 does not necessarily include only two vertically extendingportions 157 and two first support portions 131. In FIG. 10B, the microcomponent support 330 includes three vertically extending portions 157and three first support portions 131. The three vertically extendingportions 157 are respectively connected to the three first supportportions 131. The three vertically extending portions 157 arerespectively disposed on locations that are adjacent to two oppositesides of the micro component 200 and a location that is adjacent to anadjacent side that connects the two opposite sides, and the adjacentside is an adjacent side that is of two adjacent sides connecting thetwo opposite sides and that is remoter relative to the verticallyextending portions 157 that are disposed adjacent to the two oppositesides. The three vertically extending portions 157 are respectively andcorrespondingly disposed on locations that are adjacent to the twoopposite sides of the micro component 200 and a location that isadjacent to an adjacent side that connects the two opposite sides.

In FIG. 10C, the micro component support 330 includes four verticallyextending portions 157 and four first support portions 131. The fourvertically extending portions 157 are respectively connected to the fourfirst support portions 131. The four vertically extending portions 157are respectively and roughly disposed at four corners of the microcomponent, and the four second support portion 151 are also respectivelyand correspondingly disposed at the four corners of the micro component200, but this is not limited thereto. In another embodiment, two of thefour vertically extending portions 157 are disposed adjacent to one ofthe two opposite sides of the micro component 200, and the other twovertically extending portions 157 are disposed adjacent to the other ofthe two opposite sides of the micro component 200.

In the foregoing architecture, the micro component support 330 includesmultiple branches that are connected to the micro component 200 and thecarrier substrate 110 (refer to FIG. 10A), so that the micro component200 is prevented from falling off from the carrier substrate 110.

Further, due to the setting of the locations of the vertically extendingportions 157 and the first support portions 131, weight of the microcomponent 200 may be evenly distributed by using the micro componentsupport 330, so that the micro component 200 can be well fixed on thecarrier substrate 110.

FIG. 11 to FIG. 13 are schematic cross-sectional views of process stepsof transferring a micro component 200 according to an implementation ofthe present invention. First, as shown in FIG. 11, a transfer apparatus800 is disposed on the micro component 200. Then, the transfer apparatus800 is caused to apply a downward pressure (such as a pressure or athrust formed by the transfer apparatus 800 moving toward an innersurface of a carrier substrate 110) via the micro component 200 to asecond support portions 151 (a second support layer 150), and abreak-off part 132 that is of a first support portion 131 (a firstsupport layer 130) and that is connected to the second support portion151 (the second support layer 150) is caused to break off from the otherpart of the first support portion 131 (the first support layer 130). Forexample, the break-off part 132 is adjacent to a gap (not shown) betweentwo first support portions 131 or adjacent to a neighboring place of thegap, but this is not limited thereto. In another embodiment, thebreak-off part 132 may be further another location that is prone tobreak-off.

It should be noted that the transfer apparatus 800 herein needs to applyonly a downward pressure (or referred to as a downforce) to the microcomponent 200, and does not need to apply a horizontal force for arightward or leftward displacement, so that the micro component 200 isprevented from being displaced, tilted, or falling off.

After the break-off part 132 of the first support portion 131 breaks offfrom the other part of the first support portion 131, the transferapparatus 800 drives the micro component 200, the second support portion151 (the second support layer 150), and the break-off part 132 (a partof the first support portion 131) to move downwardly, so that thebreak-off part 132 is in contact with the carrier substrate 110.

As shown in FIG. 4 and FIG. 11, because the orthographic projection ofthe first opening 121 on the carrier substrate 110 and the orthographicprojection of the second opening 141 on carrier substrate 110 are notoverlapped, an orthographic projection on the carrier substrate 110 ofthe first support portion 131 formed in the first opening 121 and anorthographic projection on the carrier substrate 110 of the verticallyextending portion 157 of the second support portion 151 formed in thesecond opening 141 are not overlapped. In this way, the break-off part132 that is connected to the vertically extending portion 157 issuspended, and there is a gap between the break-off part 132 and thecarrier substrate 110. When the transfer apparatus 800 applies adownward pressure via the micro component 200 to the second supportportion 151, because the break-off part 132 is suspended, the break-offpart 132 breaks off from the other part of the first support portion131, and the micro component 200, the second support portion 151 and thebreak-off part 132 (a part of the first support portion 131) movedownwardly. In this way, the break-off part 132 is in contact with thecarrier substrate 110.

Further, because the thickness T3 of the second sacrificial layer 140 issubstantially greater than the thickness T2 of the first sacrificiallayer 120, the height H2 of the vertically extending portion 157 of thesecond support portion 151 is caused to be substantially greater thanthe height H1 of the first support portion 131. In this case, when thebreak-off part 132 is in contact with the carrier substrate 110, thesecond support portion 151 (the second support layer 150) is in contactwith only the break-off part 132, and is not in contact with the otherpart of the first support portion 131 (the first support layer 130).

As shown in FIG. 12, the transfer apparatus 800 extracts the microcomponent 200, and extracts, at the same time, the second supportportion 151 and the break-off part 132 that are connected to the microcomponent 200.

As shown in FIG. 13, the transfer apparatus 800 (refer to FIG. 12)places the micro component 200 on a fixing layer 320 of a displaysubstrate 310 (or referred to as a receiving substrate). In this case,an adhesive force of the fixing layer 320 is substantially greater thanan attraction force (or referred to as an adhesive force) of thetransfer apparatus 800 on the micro component 200. Therefore, after themicro component 200 is placed on the fixing layer 320, the microcomponent 200 adheres to the fixing layer 320 and falls off from thetransfer apparatus 800.

As shown in FIG. 11, for the second support portion 151 and thebreak-off part 132 that are connected to the micro component 200, onlythe break-off part 132 is in contact with the carrier substrate 110, anda contact area between the break-off part 132 and the carrier substrate110 is not large. Therefore, it is not necessary to worry that afterbeing in contact for an excessively long period, the break-off part 132and the carrier substrate 110 are electrostatically attracted to eachother and then the micro component 200 cannot be extracted from thecarrier substrate 110. Therefore, on the foregoing premise, the transferapparatus 800 does not need to apply a relatively great downforce toreduce a time of contact between the break-off part 132 and the carriersubstrate 110, and the micro component 200 can be prevented from beingdamaged because of an excessively great downforce.

Further, in the foregoing architecture, the contact area between thebreak-off part 132 and the carrier substrate 110 is not large, so that atool that has a relatively small line width does not need to be changedto specially to reduce the contact area between the break-off part 132and the carrier substrate 110. Therefore, for the entire process, arequirement for constructing multiple components is avoided, so thatprocess yield and process efficiency can be further improved.

As shown in FIG. 13, another implementation of the present inventionprovides a display panel 300. The display panel 300 includes: a displaysubstrate 310, a fixing layer 320, at least one support 340, and atleast one micro component 200. The fixing layer 320 is disposed on thedisplay substrate 310. The support 340 includes a platform portion 159and a plurality of extending portions 158. The platform portion 159 isdisposed on the fixing layer 320, and the extending portions 158 extendfrom the platform portion 159 to the fixing layer 320. The microcomponent 200 is disposed on the platform portion 159.

The material of the fixing layer 320 may be an organic material (such asphotoresist). It should be noted that the foregoing specificimplementation of the fixing layer 320 is merely an example, and is notintended to limit the present invention. A person of ordinary skill inthe technical field to which the present invention belongs should selecta specific implementation of the fixing layer 320 according to an actualrequirement.

Each extending portion 158 further includes a vertically extendingportion 157 and a horizontally extending portion 133. The verticallyextending portion 157 includes a first end 157 i and a second end 157ii. The first end 157 i is connected to the platform portion 159 and thehorizontally extending portion 133 is connected to the second end 157ii.

In some embodiments, the width of the vertically extending portion 157is substantially greater than the thickness of the horizontallyextending portion 133, and the length of the vertically extendingportion 157 is substantially greater than the thickness of thehorizontally extending portion 133. It should be noted that theforegoing specific implementations of the vertically extending portion157 and the horizontally extending portion 133 are merely examples, andare not intended to limit the present invention. A person of ordinaryskill in the technical field to which the present invention belongsshould select specific implementations of the vertically extendingportion 157 and the horizontally extending portion 133 according to anactual requirement.

In some embodiments, the thickness of the platform portion 159 issubstantially greater than the thickness of the horizontally extendingportion 133, and the thickness of the platform portion 159 issubstantially less than the width of the vertically extending portion157. It should be noted that the foregoing specific implementations ofthe platform portion 159, the horizontally extending portion 133, andthe vertically extending portion 157 are merely examples, and are notintended to limit the present invention. A person of ordinary skill inthe technical field to which of the present invention belongs shouldselect specific implementations of the platform portion 159, thehorizontally extending portion 133, and the vertically extending portion157 according to an actual requirement.

In some embodiments, the length of vertically extending portion 157 issubstantially greater than the width of the vertically extending portion157. It should be noted that the foregoing specific implementation ofthe vertically extending portion 157 is merely an example, and is notintended to limit the present invention. A person of ordinary skill inthe technical field to which the present invention belongs should selecta specific implementation of the vertically extending portion 157according to an actual requirement.

A type of the micro component 200 in this embodiment may be the same asthat described above in the foregoing embodiment, and details are notdescribed herein again.

In the foregoing implementation of the present invention, because themicro component support includes multiple branches that are connected tothe micro component and the carrier substrate, the micro component isprevented from falling off from the carrier substrate.

Further, for a second support portion and a break-off part that areconnected to the micro component, only the break-off part is in contactwith the carrier substrate, and a contact area between the break-offpart and the carrier substrate is not large. Therefore, it is notnecessary to worry that after being in contact for an excessively longperiod, the break-off part and the carrier substrate areelectrostatically attracted to each other and then the micro componentcannot be extracted from the carrier substrate. Therefore, on theforegoing premise, a transfer apparatus does not need to apply arelatively great downforce to reduce a time of contact between thebreak-off part and the carrier substrate, so that the micro componentcan be prevented from being damaged because of an excessively greatdownforce.

Further, in the foregoing architecture, the contact area between thebreak-off part and the carrier substrate is not large, so that a toolthat has a relatively small line width does not need to be changed tospecially to reduce the contact area between the break-off part and thecarrier substrate. Therefore, for the entire process, a requirement forconstructing multiple components is avoided, so that process yield andprocess efficiency can be further improved.

Although the present invention has been disclosed by using theimplementations, the implementations are not intended to limit thepresent invention, and a person skilled in the art may make variousmodifications and improvements without departing from the spirit andscope of the present invention. Therefore, the protection scope of thepresent invention should be subject to the scope defined by the claims.

What is claimed is:
 1. A method for forming a micro component support,comprising: forming a first sacrificial layer on a carrier substrate,wherein the first sacrificial layer comprises a plurality of firstopenings, and the first openings expose the carrier substrate; forming afirst support layer on the first sacrificial layer and in the firstopenings; forming a second sacrificial layer on the first sacrificiallayer and the first support layer, wherein the second sacrificial layercomprises a plurality of second openings, and the second openings exposethe first support layer; forming a second support layer on the secondsacrificial layer and in the second openings; and removing the firstsacrificial layer and the second sacrificial layer after forming a microcomponent on the second support layer.
 2. The method according to claim1, wherein the second opening is narrower than the first opening.
 3. Themethod according to claim 1, wherein the second sacrificial layer isthicker than the first sacrificial layer.
 4. The method according toclaim 1, wherein the second support layer is thicker than the firstsupport layer.
 5. The method according to claim 1, wherein a thicknessof the second support layer is less than a width of the second opening.6. The method according to claim 1, wherein a thickness of the firstsupport layer is less than a width of the first opening.
 7. The methodaccording to claim 1, wherein the step of forming the first supportlayer further comprises: patterning the first support layer to form aplurality of first support portions, wherein the first support portionsare mutually separated, and each of the first support portions iscorresponding and disposed in each of the first openings.
 8. The methodaccording to claim 1, wherein the first openings and the second openingsdo not overlap.
 9. The method according to claim 1, wherein the step offorming the first support layer further comprises: forming the firstsupport layer on the carrier substrate via the first openings.
 10. Themethod according to claim 1, wherein the step of forming the secondsupport layer further comprises: forming the second support layer on thefirst support layer via the second openings.
 11. The method according toclaim 10, further comprising: disposing a transfer apparatus on themicro component; and causing the transfer apparatus to apply a downforce via the micro component to the second support layer, and to breakthe first support layer where the first support layer connects to thesecond support layer.
 12. The method according to claim 11, furthercomprising: driving, by the transfer apparatus, the micro component, thesecond support layer, and a first break-off part to move downwardly,wherein the first support layer is broken into the first break-off partand a second break-off part, the first break-off part is in contact withthe carrier substrate, and the second support layer is not in contactwith the second break-off part of the first support layer.
 13. A displaypanel, comprising: a display substrate; a fixing layer, disposed on thedisplay substrate; a support, comprising a platform portion and aplurality of extending portions, wherein the platform portion isdisposed on the fixing layer, and the extending portions extend from theplatform portion to the fixing layer; and a micro component, disposed onthe platform portion.
 14. The display panel according to claim 13,wherein each of the extending portions further comprises: a verticallyextending portion, comprising a first end and a second end, wherein thefirst end is connected to the platform portion; and a horizontallyextending portion, connected to the second end.
 15. The display panelaccording to claim 14, wherein a width of the vertically extendingportion is greater than a thickness of the horizontally extendingportion.
 16. The display panel according to claim 14, wherein a lengthof the vertically extending portion is greater than a thickness of thehorizontally extending portion.
 17. The display panel according to claim14, wherein the platform portion is thicker than the horizontallyextending portion.
 18. The display panel according to claim 14, whereina thickness of the platform portion is less than a width of thevertically extending portion.
 19. The display panel according to claim14, wherein a length of the vertically extending portion is greater thana width of the vertically extending portion.
 20. The display panelaccording to claim 13, wherein the micro component is a micro lightemitting diode.